Samsung Electro-Mechanics to invest $3.14 bil. for substrate plant in Sejong
koreatimes.co.kr Sep 28, 2026

Samsung Electro-Mechanics to invest $3.14 bil. for substrate plant in Sejong

AI-summarised brief · reviewed before publication

Samsung Electro‑Mechanics announced a 4.27 trillion‑won ($3.14 billion) investment to expand its flip‑chip ball‑grid‑array (FC‑BGA) substrate capacity at its Sejong plant. The expansion, the largest single‑product capex in the company’s history, will run from September 2026 to May 2028, with mass production slated for September 2028. The move targets rising demand from AI servers and other high‑performance computing sectors, backed by long‑term agreements with major global tech firms. The investment is part of a broader commitment to invest 8 trillion won in Chungcheong and 15 trillion won in Busan by 2040.

💡 Why It Matters

  • · By scaling FC‑BGA production, Samsung Electro‑Mechanics positions itself to secure a steady supply for AI and automotive markets, strengthening its foothold in the high‑value substrate segment.