Applied Materials, Besi Expand Advanced Packaging Partnership for AI Scaling
AI-summarised brief · reviewed before publication
Applied Materials and BE Semiconductor Industries (Besi) have broadened their strategic partnership by adding Besi as an Innovation Partner to Applied’s EPIC Center. The move extends the collaboration that began in 2020, which produced the Kinex™ hybrid bonding system, into new interconnect architectures and advanced packaging flows needed for AI‑driven chip scaling. Engineers from both firms will co‑develop die‑to‑wafer, die‑on‑die, die‑on‑panel and photonics‑enabled interconnect solutions, integrating front‑end materials processes with back‑end assembly. The expanded effort targets higher‑density, higher‑bandwidth chip‑to‑chip and chip‑to‑package connections for AI compute and memory, leveraging the EPIC Center’s $5 billion investment to accelerate the path from research to high‑volume manufacturing. Customers will gain earlier access to co‑optimized packaging technologies across the full advanced‑packaging flow.
💡 Why It Matters
- · By uniting front‑end materials expertise with Besi’s assembly know‑how, the partnership shortens development cycles for the ultra‑dense interconnects that power next‑generation AI systems.
