SK hynix Eyes HBM5 Launch by 2029 with Hybrid Bonding
AI-summarised brief · reviewed before publication
SK hynix, the world's second-largest memory chipmaker, is expected to launch its eighth-generation High Bandwidth Memory, HBM5, in 2029 using hybrid bonding technology. This aligns with customers' next-generation AI GPU cycles, delivering higher performance and efficiency. Hybrid bonding eliminates the need for bumps between stacked chips, making HBM thinner and improving data transfer speeds and heat dissipation, a significant advancement for AI accelerators.