NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
semiconductor-digest.com Apr 14, 2026

NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments

AI-summarised brief · reviewed before publication

Researchers at NIST have developed a new way to package photonic integrated circuits, enabling them to survive in extreme environments. This breakthrough allows photonic chips to operate in scorching heat, ultracold vacuum chambers, and outer space. The new method, hydroxide catalysis bonding, creates a stable connection between optical fibers and photonic chips, withstanding intense radiation, temperature swings, and high vacuum, paving the way for use in quantum technologies, space missions, and industrial applications.