FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry
semiconductor-digest.com May 14, 2026

FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry

AI-summarised brief · reviewed before publication

FotoNation and SEMIFIVE have announced a strategic collaboration for the turnkey development of TriSilica, an ultra-low-power perceptual AI chip family. SEMIFIVE will lead the development, leveraging its expertise in high-complexity, low-power IC design and integrated packaging technologies. The collaboration marks SEMIFIVE's first European deal, expanding its presence in the market. The initial product, the TS-210, is planned for a Multi-Project Wafer shuttle by the end of the year, using Samsung Foundry's 8nm Low Power Ultimate process. This partnership aims to commercialize FotoNation's next-generation sensor-fusion SoCs, targeting the edge AI market with advanced image processing and sensor-fusion technology, and is expected to drive growth in the industry.

💡 Why It Matters

  • · The partnership brings together FotoNation's pioneering Vision AI technology and SEMIFIVE's custom semiconductor expertise, poised to redefine edge AI capabilities.
  • · Advanced image processing and sensor-fusion technology will be driven forward by this collaboration.