TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi
wccftech.com May 16, 2026

TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi

AI-summarised brief · reviewed before publication

A research report from Citibank states that TSMC's advanced packaging and chip manufacturing technologies are unlikely to face significant competitive pressures from Intel. The report highlights that TSMC's CoWoS packaging technology capacity may grow due to AI demand in 2026 and 2027. Intel's EMIB-T packaging technology relies on ABF substrates, and its success depends on the maturity of the ABF ecosystem, which may face production constraints.

💡 Why It Matters

  • · TSMC's control over key raw materials gives it a strong position in the AI industry.
  • · Scalability of Intel's EMIB technology hinges on ABF suppliers' ability to ramp up production.