ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation
semiconductor-digest.com May 27, 2026

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

AI-summarised brief · reviewed before publication

Advanced Semiconductor Engineering, Inc. (ASE) has announced the development of an automated 310mm × 310mm panel-level packaging production line, marking a significant milestone in next-generation advanced packaging technologies. This innovation enables seamless transition from wafer-level packaging to panel-level packaging, expanding economies of scale and preserving design rule consistency. The new panel line is expected to enter production in the first half of 2027 and supports 310mm × 310mm format with advanced packaging platforms including FOCoS and FOCoS-Bridge.

💡 Why It Matters

  • · The shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency, and enables integration of increasingly complex multi-die architectures.
  • · This innovation is especially impactful for AI data center and HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate.