Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
semiconductor-digest.com May 29, 2026

Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand

AI-summarised brief · reviewed before publication

Cadence and Samsung Foundry have deepened their collaboration to develop a full portfolio of Memory and Interface IP, and expanded certification of Cadence's agentic AI digital, custom, 3D-IC, and system design and analysis flows for Samsung's second-generation 2nm process technology. This collaboration delivers a signoff-ready platform for next-generation AI infrastructure and physical AI designs across data centers, edge devices, and intelligent devices. The partnership further broadens Cadence's portfolio of Memory and Interface IP, including NVIDIA NVLink-C2C-enabled interconnect and CUDA-X GPU-accelerated libraries.

💡 Why It Matters

  • · The semiconductor ecosystem's ability to produce high-performance AI semiconductors depends on tools and platforms that can keep pace with simulation and design complexity at advanced nodes.
  • · By leveraging Cadence's GPU-accelerated design flows on Samsung Foundry's second-generation 2nm platform, the industry can optimize the performance and delivery of next-generation AI architectures and high-bandwidth interconnects.