Beating AI Bottlenecks with Better Switches
AI-summarised brief · reviewed before publication
Menlo Microsystems' CEO Russell Garcia highlights the challenges of testing AI chips, which have extremely dense pinouts and 2.5D and 3D integration technologies. Traditional automatic test equipment uses crosspoint relay matrices, but these have measurable actuation and settling times, and armature vibration introduces noise into measurements. Menlo Micro's MEMS-based relays offer near-ideal switching characteristics, enabling almost instantaneous signal routing with negligible interference. This technology ensures production testing keeps pace with AI chip evolution, rather than becoming a bottleneck.
💡 Why It Matters
- · The widespread adoption of AI chips, driven by a $252.3 billion corporate investment in 2024, requires test infrastructure that can match their speed and reliability.
- · Menlo Micro's MEMS-based relays remove a structural constraint, enabling the production testing of AI chips to keep pace with their evolution, rather than limiting their deployment.