Optimizing ABF Drilling with Picosecond Lasers
semiconductor-digest.com Jun 9, 2026

Optimizing ABF Drilling with Picosecond Lasers

AI-summarised brief · reviewed before publication

Researchers at MKS Spectra-Physics have explored the use of picosecond lasers for drilling microvias in Ajinomoto Build-up Film (ABF) substrates, addressing limitations of nanosecond UV lasers. The Spectra-Physics IceFyre UV50 laser delivers configurable pulse bursts, allowing for "burst-on-the-fly" drilling and combining speed with accuracy. Testing showed that optimal burst parameters can prevent copper damage and produce round vias with minimal taper. The technique enables process tailoring and achieves maximum material removal and improved hole taper simultaneously, supporting production throughput levels for advanced packaging applications with high interconnect densities.