Bosch Announces $225M Direct Funding Agreement with the U.S. Department of Commerce
semiconductor-digest.com Jul 13, 2026

Bosch Announces $225M Direct Funding Agreement with the U.S. Department of Commerce

AI-summarised brief · reviewed before publication

Bosch signed a definitive agreement with the U.S. Department of Commerce to receive up to $225 million from the CHIPS Program, supporting its $2 billion investment to convert the Roseville, California plant into a silicon‑carbide (SiC) semiconductor fab. The site, which has four decades of semiconductor experience, has begun sample production and aims to ship its first commercial 200‑mm SiC chips in 2026. Bosch officials highlighted the move as a step toward localized manufacturing and supply‑chain resilience. The Trump administration framed the funding as part of a broader effort to secure critical‑technology supply chains. Bosch also announced a $7.5 billion U.S. investment plan through 2031, marking its 120th anniversary in the country. The facility will also create dozens of jobs during the rollout.

💡 Why It Matters

  • · Domestic SiC production gives U.S.
  • · automakers a home‑grown source for high‑efficiency power chips, cutting reliance on overseas suppliers.