Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging
AI-summarised brief · reviewed before publication
Tomocube has launched the HT-T1 Desktop, a holotomography system designed for high-resolution 3D defect analysis of glass substrates in advanced semiconductor packaging. The device complements automated optical inspection by reconstructing interior defect coordinates, revealing location, morphology, and depth characteristics that surface tools miss. Utilizing visible-light holotomography with 10⁻⁴ refractive-index sensitivity, the non-destructive system allows repeated measurements to track defect formation during laser drilling, etching, and metallization. This capability reduces analysis time from days to minutes, replacing destructive failure analysis methods. Tomocube also introduced TomoAnalysis MI software for quantitative 3D data analysis and reporting. CEO YongKeun Park stated the platform aids yield learning for AI accelerators and high-bandwidth memory applications. The system supports glass core substrates and interposers, enabling manufacturers to identify root causes and refine processes. Tomocube plans to expand its portfolio with an in-line module for system integration partners, addressing growing demand for efficient defect analysis in next-generation packaging workflows.
💡 Why It Matters
- · Glass substrates are critical for AI hardware, yet their complex manufacturing processes make defect root-cause analysis notoriously difficult and slow.
- · By enabling non-destructive, minute-level 3D internal inspection, this tool directly accelerates yield learning, allowing manufacturers to fix process issues before they become costly production bottlenecks.