RAM supply holding up iPhone 18 Pro assembly is another bad sign
AI-summarised brief · reviewed before publication
Apple’s new A20 Pro processor, the first chip built on TSMC’s N2 node, is stalled by a shortage of RAM that is co‑packaged at the wafer level. The integrated design prevents post‑assembly RAM insertion, leaving half‑packaged chips idle and blocking motherboard assembly. Foxconn and BYD report roughly $1 billion worth of unfinished chips. Initial launch orders will be met, but delivery delays are expected to widen, potentially pushing the iPhone 18 Pro beyond its planned release window.
💡 Why It Matters
- · The RAM bottleneck exposes the fragility of Apple’s supply chain for high‑performance chips, threatening product availability and signaling broader semiconductor shortages that could ripple through the tech industry.