Diamond-cooled microchips boost power density 3.3x for military radar signals
interestingengineering.com Aug 28, 2026

Diamond-cooled microchips boost power density 3.3x for military radar signals

AI-summarised brief · reviewed before publication

Northrop Grumman has secured a $7 million contract from the Defense Advanced Research Projects Agency (DARPA) to develop diamond-enhanced microchips capable of handling significantly higher power densities without overheating. This initiative constitutes Phase 2 of DARPA’s Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program. The project addresses a critical bottleneck in modern military electronics, where compact radio-frequency chips generate excessive heat, forcing engineers to limit performance to prevent damage. By integrating diamond directly into semiconductor devices, Northrop Grumman aims to leverage the material’s exceptional thermal conductivity, which is approximately five times faster than copper. This innovation allows chips to operate at higher power levels while maintaining safe temperatures. The technology specifically targets systems with strict size and power constraints, including military communications, radar, and satellite links. Ben Heying, director of microelectronics at Northrop Grumman’s Space Park Foundry, described the embedded diamond as a turbocharged cooling system that prevents burnout. The development seeks to overcome longstanding thermal restrictions, enabling more powerful and reliable electronic components for advanced defense applications without increasing the physical footprint of the hardware.

💡 Why It Matters

  • · Overcoming thermal limits allows defense systems to pack significantly more processing power into smaller, lighter packages.
  • · This breakthrough directly enhances the range and resolution of military radar and communication equipment without adding weight or bulk.