thequantuminsider.com
IBM and Siemens Collaborate to Advance 3D Nanostack Transistors
IBM and Siemens have joined forces to accelerate the development of IBM’s 3D nanostack transistor architecture, a vertically stacked, nanosheet-based design that promises higher chip density, energy efficiency, and performance. The partnership will focus on virtual modeling, simulation, lithography optimization, and manufacturing preparation to overcome production challenges for the current 7‑angstrom node and future generations. By combining IBM’s device innovation with Siemens’ EDA and process‑simulation expertise, the collaboration aims to bring nanostack closer to commercial production. [...]