TechCapsules

French quantum‑computing firm Pasqal (NASDAQ: PSQL) and LG CNS, the AI‑focused subsidiary of South Korea’s LG Group, signed a three‑year memorandum of understanding on September 18, 2026. The deal, announced during the France‑Korea summit in Paris, sets out a roadmap to embed Pasqal’s neutral‑atom quantum processing units (QPUs) into LG CNS’s AI Haus platform and commercial AI data‑center infrastructure across South Korea and the broader Asia‑Pacific region. The partnership will create hybrid quantum‑classical systems that combine Pasqal’s hardware with LG CNS’s cloud‑management [...]

Diraq, a silicon spin‑qubit quantum developer, and Dell Technologies have launched a technical partnership to embed Diraq’s silicon QPUs into Dell’s high‑performance computing (HPC) and AI server infrastructure. The collaboration deploys a Dell HPC cluster directly in Diraq’s Sydney lab, co‑locating classical servers with the QPU to achieve ultra‑low‑latency quantum‑classical interconnects. Initial work focuses on hybrid workflow orchestration, automating real‑time qubit calibration, tuning, and quantum error‑correction protocols, while evaluating applications in optimization, supply‑chain logistics, finance, and drug [...]

On the second day of SEMICON India 2026, officials announced 25 new collaborations spanning the semiconductor value chain, from manufacturing and materials to packaging, power electronics and workforce development. Tata Electronics signed MoUs with INOX Air Products, Sumitomo Chemical and Kelington Engineering to localise high‑purity gases, wet chemicals and fab‑readiness infrastructure, while also partnering with Enomoto to boost lead‑frame packaging R&D. C‑MET and Hindalco agreed to scale critical raw‑material production, and the Ministry of Power teamed with [...]

Dutch chipmaker Nexperia has signed a partnership with India’s Tata Electronics to produce and package power‑control chips at Tata’s upcoming semiconductor complex. The agreement covers front‑end wafer fabrication at the $11 billion Dholera fab in Gujarat and back‑end assembly and test at Tata’s Jagiroad facility in Assam. Under the deal Nexperia will introduce its MOSFET portfolio to the 300 mm line, while both firms will cooperate on technology development and ecosystem building. The collaboration follows Nexperia’s split from former [...]

ICTK Co., Ltd., a South Korean quantum‑security fabless firm, and Jiran Security, a cybersecurity specialist, signed a memorandum of understanding to launch Q‑BRIDGE, a commercial service that delivers end‑to‑end post‑quantum cryptography (PQC) migration for enterprises, government agencies and financial institutions. The partnership combines Jiran’s Crypto Discovery platform, which audits cryptographic assets, identifies vulnerabilities and creates migration roadmaps, with ICTK’s hardware‑rooted security architecture built on its VIA PUF™ hardware root‑of‑trust chips. Jiran will conduct initial diagnostics for more [...]

ASML Holding’s executive vice‑president Wayne Allan announced a partnership with Tata Electronics to back India’s first 300 mm semiconductor fabrication plant, unveiled at Semicon India 2026. The collaboration, formalised through a memorandum of understanding, aims to secure the fab’s success and lay the groundwork for additional 300 mm lines. Allan stressed that a complete domestic ecosystem—silicon production, packaging, testing and module assembly—is essential for meeting India’s growing chip demand. He projected the Indian semiconductor market will reach $110 billion by 2030 [...]

Hideo Kojima announced that Bill Skarsgård will star as the lead in his upcoming action‑espionage title Physint, revealed during the Xbox Tokyo Game Show 2026 broadcast alongside a teaser poster. The poster shows a blonde‑haired Skarsgård with co‑star Charlee Fraser and the tagline “The Next Cold War Begins.” Kojima said the casting reflects a long‑standing mutual admiration and cited costume fittings, scans and camera tests that boosted his confidence. Physint, described as a spiritual successor to the [...]

Alice & Bob, a leader in fault‑tolerant quantum computing, announced a partnership with France’s CEA to embed its quantum software stack into hybrid quantum‑HPC systems. The collaboration will link Alice & Bob’s Helium quantum system to CEA’s Qaptiva platform, enabling access through existing HPC infrastructure. A joint research program will develop algorithms for many‑body physics problems, targeting early fault‑tolerant quantum computers around 2030. The initiative aims to demonstrate industrial‑grade use cases in condensed‑matter physics and accelerate quantum‑HPC [...]