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SK hynix Ships Samples of 12-Layer Next-Gen ‘HBM4E’
SK hynix has shipped samples of its 12-layer next-generation HBM4E to major customers, achieving a maximum speed of 16Gbps per pin with improved performance and efficiency. The HBM4E utilizes Advanced MR-MUF, reducing heat resistance by 17% and improving stability. This development strengthens SK hynix's AI leadership, delivering value to the market with its technological capabilities and manufacturing expertise. The company will work closely with partners for mass production, improving data processing capabilities for AI training and inference. [...]