ASM International of the Netherlands unveiled XP8 Vertos Flowable Carbon, the first plasma‑enhanced chemical vapor deposition (PECVD) flowable carbon film, on Sept. 22. The material simultaneously fills high‑aspect‑ratio gaps and planarizes complex 3D chip structures in a single PECVD step, eliminating downstream chemical‑mechanical planarization or etch‑back processes. It conforms to intricate features, self‑smooths during deposition, and avoids voids, while offering higher thermal stability and area‑selective deposition. The technology is already in high‑volume manufacturing for both logic and memory [...]

Cognex Corporation unveiled the In‑Sight 1750 Series, a wafer and panel identification system that uses AI, advanced imaging, and specialized illumination to read degraded marks and challenging substrates. Designed for semiconductor fabs expanding AI and advanced computing capacity, the system aims to reduce disruptions, enhance traceability, and preserve throughput. It offers reliable reads, fewer operator interventions, quicker upgrades from older models, and higher equipment utilization, all while integrating smoothly into existing production lines. The launch underscores Cognex’s [...]

IC-Link by imec and TSMC announced an expanded partnership that adds IC-Link to TSMC’s Open Innovation Platform Cloud Alliance. The move makes IC-Link the first managed‑cloud service to support mixed‑partner EDA flows for silicon design, offering secure cloud infrastructure, advanced‑node process design kits, and expert support. The collaboration aims to simplify complex chip development for AI, automotive, communications, and industrial markets, enabling customers to focus on innovation while accessing scalable compute resources and TSMC’s leading technology. [...]

Valens Semiconductor announced a partnership with onsemi to develop a cost‑optimized integrated sensor for high‑volume 3‑megapixel automotive cameras. The collaboration aims to accelerate OEM and Tier‑1 access to MIPI A‑PHY, enabling a streamlined camera architecture that reduces component count while maintaining performance. Valens will embed its A‑PHY connectivity into onsemi’s image sensors, expanding the standard’s reach into mainstream vehicles. Both companies highlighted the growing demand for simplified, high‑speed sensor solutions in automotive imaging. [...]

Addverb, an Indian robotics firm known for warehouse automation, announced at SEMICON India 2026 that it is entering the semiconductor manufacturing market. The company will develop specialised robotic systems for precision material handling, automated storage, and component movement inside semiconductor and advanced‑electronics fabs. Leveraging its portfolio of autonomous mobile robots, ASRS, robotic arms and AI‑enabled tracking, Addverb aims to meet cleanroom requirements such as contamination control, vibration mitigation and electrostatic discharge protection. The move also extends to [...]

The edge artificial intelligence accelerator market is projected to surge from $11.1 billion in 2025 to $14.85 billion in 2026, a 33.8 % CAGR, and to reach $47.2 billion by 2030 with a 33.5 % CAGR. Growth is driven by expanding IoT deployments, smart manufacturing, autonomous systems, and the need for low‑latency, on‑device AI processing. Key trends include energy‑efficient chips, real‑time vision workloads, and compact hardware designs for edge use cases. Major players such as Apple, Intel, NVIDIA, Qualcomm, AMD, Arm, and [...]

The Semiconductor Industry Association announced that Apple Executive Chair Tim Cook will receive the 2026 Robert N. Noyce Award, the industry’s highest honor. The award recognizes Cook’s advocacy for U.S. semiconductor leadership and his role in driving growth and advanced manufacturing. Cook will accept the award at the SIA Awards Dinner on Nov. 19, 2026, in San Jose, California. The announcement highlights Cook’s influence on Apple’s semiconductor-enabled products and his broader impact on the global technology landscape. [...]