Chinese memory‑chip maker ChangXin Memory Technologies (CXMT) is preparing to launch a research‑and‑development production line for NAND flash at its new Beijing plant, according to two sources familiar with the plan. The initiative would extend CXMT’s current focus on DRAM into the NAND market, which is dominated by Samsung and other foreign firms, and put it in direct competition with domestic rival Yangtze Memory Technologies (YMTC). CXMT has already discussed its NAND offering with customers, including a [...]

Researchers have unveiled a silicon‑carbide lateral high‑voltage bi‑directional field‑effect transistor that can conduct current and block voltage in both forward and reverse directions. The device replaces the conventional practice of pairing two separate SiC chips by embedding bidirectional capability within each unit cell, and adds a Schottky diode to improve conductivity. Its lateral architecture enables compact integration into complex power‑electronics ICs, targeting applications such as current‑source inverters, matrix converters, bidirectional EV chargers and renewable‑energy converters. By shrinking [...]

Solidigm, the storage‑chip subsidiary of South Korea’s SK Hynix, is weighing the construction of a NAND flash factory in the United States, according to three sources familiar with the talks. The site under consideration is Upstate New York, which would shift part of the company’s production away from China amid growing U.S. pressure for foreign chipmakers to localise manufacturing. No formal agreement has been reached; details such as investment size, production capacity and the build timeline remain unsettled. Solidigm [...]

On the second day of SEMICON India 2026, officials announced 25 new collaborations spanning the semiconductor value chain, from manufacturing and materials to packaging, power electronics and workforce development. Tata Electronics signed MoUs with INOX Air Products, Sumitomo Chemical and Kelington Engineering to localise high‑purity gases, wet chemicals and fab‑readiness infrastructure, while also partnering with Enomoto to boost lead‑frame packaging R&D. C‑MET and Hindalco agreed to scale critical raw‑material production, and the Ministry of Power teamed with [...]

Madhya Pradesh Chief Minister Mohan Yadav announced plans to develop Bhopal, the Indore‑Ujjain metropolitan area and other regions as semiconductor manufacturing hubs after inaugurating a semiconductor lab at the state pavilion during SEMICON India 2026 in New Delhi. Yadav highlighted the state’s investor‑friendly policies, extensive land bank, reliable power supply, skilled workforce and stable law‑and‑order environment as advantages for attracting domestic and foreign chip makers. He said the initiative will create technical jobs for youth and foster skill [...]

GlobalFoundries and Marvell Technology have signed an expanded multi‑year agreement to boost capacity for GF’s silicon‑germanium (SiGe) production at the Burlington, Vermont fab. The deal targets the growing need for high‑speed optical interconnects in AI‑driven data centers, focusing on next‑generation pluggable transceivers, Near‑Packaged Optics (NPO) and Co‑packaged Optics (CPO). GF’s SiGe portfolio delivers the frequency, signal integrity and power efficiency required for 200 Gb/s‑per‑lane links and is positioned for faster generations as bandwidth demands rise. The partnership builds [...]

Apple has agreed to Samsung Electronics’ new pricing for LPDDR5X RAM and NAND flash memory that will take effect in the first quarter of 2027, according to South Korean industry reports. The deal raises Apple’s component cost to roughly $2 per gigabit for DRAM and $0.33 per gigabit for NAND, representing a 30‑40 % increase over Samsung’s 2026 baseline rates of $1.50 and $0.26 respectively. Analysts say the higher bill of materials could force Apple to lift iPhone [...]