Korean University researchers have engineered a “double‑confined” phase‑change memory cell that layers antimony telluride with nickel ditelluride and molybdenum ditelluride. The design confines heat to specific regions, allowing two distinct data states to be written sequentially without disturbing the underlying material. This architecture reduces reset energy by up to 76 % to 115 pJ, speeds switching to 50 ns, and extends endurance beyond one million cycles. The thin layers can be deposited with existing sputtering equipment, making the technology scalable [...]

Intel CEO Lip‑Bu Tan warned that memory scarcity is now the primary obstacle for companies building AI infrastructure, citing a five‑to‑seven‑fold rise in memory prices and limited production that forces project delays. Speaking at Splunk’s .conf26 in Denver, Tan explained that demand for high‑bandwidth memory (HBM) from Nvidia and AMD accelerators has outstripped the output of Samsung, SK hynix and Micron, prompting a shift of existing lines to HBM and reducing capacity for standard DRAM. He relayed industry [...]

Nordic Semiconductor unveiled the nRF54LC10A system‑on‑chip, targeting ultra‑low‑cost tags, trackers and smart‑home sensors. The device integrates Bluetooth LE, Bluetooth Channel Sounding, Thread, Zigbee and Matter, and offers the same security and software ecosystem as the higher‑end nRF54L series. It is built around a 128 MHz Arm Cortex‑M33 core with a RISC‑V co‑processor, 1 MB non‑volatile memory, 192 KB RAM, three SPI/TWI/UART interfaces and an ADC. Radio performance includes 4.0 mA receive and 5.8 mA transmit currents at 0 dBm, +4 dBm peak output, –97 dBm [...]

India’s semiconductor sector received a major boost at SEMICON India 2026, inaugurated by Prime Minister Narendra Modi in New Delhi. The three‑day showcase at Yashobhoomi attracted over 40,000 visitors, 400 executives, 150 speakers and 600 companies from 52 nations. More than 50 memoranda of understanding were signed, underpinning the government’s Rs 1,27,500 crore (≈ USD 15 billion) budget for the “Semicon 2.0” roadmap, which focuses on design, fab construction, ATMP/OSAT capacity, equipment, R&D and talent development. Union Minister Ashwini Vaishnaw announced investment pledges totalling roughly Rs 1 lakh crore (USD 11‑12 billion). [...]

Taiwan inaugurated an advanced‑packaging industrial park in Kaohsiung on Monday, marking a major expansion of its semiconductor ecosystem. The Baipu Industrial Park, spanning about 88.7 hectares, will host two TSMC facilities: a technology‑validation laboratory and a talent‑training centre, slated to start operations in Q4 2029. Deputy Mayor Lo Ta‑sheng said the site will enable equipment and material suppliers to conduct research alongside TSMC’s packaging lines. President Lai Ching‑te highlighted the strategic role of advanced packaging in AI and [...]

Assam is on the cusp of launching its Tata Electronics semiconductor OSAT plant in Jagiroad, with trial runs now at roughly 25 % of capacity and commercial production slated for December‑January. The 592‑acre facility represents a ₹27,000 crore investment and is designed to output up to 48 million chips per day using advanced flip‑chip and ISIP packaging. Initial output will serve automotive, electric‑vehicle, telecom and consumer‑electronics sectors, while full‑scale capacity and a stable supply chain are expected to mature over [...]

India now operates five commercial semiconductor units and has attracted equipment makers such as ASML, Applied Materials and Lam Research, marking a shift from policy announcements to tangible production. Experts say the next hurdle is building a full‑stack ecosystem that can turn capital into globally competitive output. While the country boasts a large engineering talent pool and strong chip‑design capabilities, it lacks specialised skills in process engineering, manufacturing operations, yield management and advanced packaging, which are essential [...]