EV Group Highlights Hybrid Bonding, Layer Transfer and Maskless Lithography Technologies for Heterogeneous Integration and Advanced Packaging at ECTC 2026
AI-summarised brief · reviewed before publication
EV Group will showcase its latest solutions for heterogeneous integration and advanced packaging at the 2026 IEEE Electronic Components and Technology Conference. The company's solutions include wafer bonding systems, die-to-wafer overlay metrology, layer transfer technology, and maskless exposure systems. These technologies enable manufacturing advances in high-bandwidth memory, complementary field-effect transistors, and 3D/chiplet integration. EV Group will participate in seven technical sessions and a professional development course, highlighting hybrid bonding, layer transfer, and maskless lithography. The company's process solutions support scalable and proven process integration technologies for next-generation devices. EV Group aims to collaborate with the semiconductor ecosystem at ECTC.
💡 Why It Matters
- · Hybrid bonding technology is crucial for advancing high-bandwidth memory and 3D integration, driving demand for scalable process integration technologies.
- · EV Group's solutions address this need, enabling semiconductor manufacturers to bring next-generation devices into high-volume manufacturing.