semiconductor-digest.com
Oct 13, 2026
Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates
AI-summarised brief · reviewed before publication
SEMI’s latest 300mm Fab Outlook projects global front‑end equipment spending to hit $149 billion in 2026, rising 31% YoY, and to reach $227 billion by 2029 as double‑digit growth continues. The outlook notes a robust pipeline of 20 new 300mm fabs or lines beginning construction in 2026 and 18 in 2027, with the U.S. accounting for three in 2026 and four in 2027. Construction spending is expected to climb from $47.5 billion in 2026 to $68.4 billion in 2028, supporting logic, memory, and other advanced technologies.
💡 Why It Matters
- · The surge in 300mm fab investment signals a decisive shift toward higher‑yield, high‑performance chips that will underpin AI, HPC, and next‑generation semiconductor applications.
