HANMI Semiconductor To Launch Second-Generation Hybrid Bonder by End of 2026
AI-summarised brief · reviewed before publication
HANMI Semiconductor plans to launch a second-generation hybrid bonder by the end of 2026, enabling thinner, high-density interconnects for next-generation HBM production. The equipment builds on the company's foundation in core technologies and process verification expertise, improving nanometer-level precision and process stability. A hybrid bonder factory is set to open in 2027, supporting the production of next-generation equipment. The company aims to maintain its leadership in the TC bonder market while advancing hybrid bonder technology.