TechCapsules

AI-summarised brief · reviewed before publication

At SEMICON Europa 2026, Hummink announced its BIRD module, a high‑precision capillary printing system that integrates micron‑scale printing, defect repair, and surface functionalization directly into advanced packaging lines. The module, built on Hummink’s HPCaP technology, can deposit materials from 0.6 to 50 µm, repair RDL defects, and functionalize surfaces with minimal material use. A pilot deployment is underway at a major Asian semiconductor and display manufacturer, marking the first production‑line use of BIRD in advanced manufacturing.