imec Unlocks III-V Chiplet Integration on 300mm Silicon
AI-summarised brief · reviewed before publication
Imec has advanced its 300mm RF silicon interposer platform for heterogeneous integration of III-V chiplets on Si-CMOS, combining high-density embedded capacitors, a scalable modeling framework, and laser-assisted bonding. This platform enables next-generation wireless systems and RF-grade signal handling for data centers. Imec's advancements include a 10-to-100-fold increase in MIMCAP capacitance density and a modeling framework for predictable design of passive components up to sub-THz frequencies. The platform integrates III-V chiplets with negligible insertion loss, supporting compact and cost-efficient system designs. Imec's work demonstrates a uniquely integrated platform for performance, scalability, and manufacturability, with potential applications in mmWave and sub-THz wireless systems.