NTT Consortium Developing Mass-Production Tech for Optical Chiplets

semiconductor-digest.com Oct 20, 2026

NTT Consortium Developing Mass-Production Tech for Optical Chiplets

Curated by Shubham · TechCapsules · Oct 20, 2026

AI-summarised brief · reviewed before publication

NTT, NTT Innovative Devices, Japan Semiconductor, Furukawa Electric, and Shinko Electric Industries announced a NEDO‑funded joint R&D project to create mass‑production technologies for optical chiplets. The consortium will develop manufacturing, testing, and packaging processes that enable photonics‑electronics convergence (PEC) devices, targeting a tenfold productivity boost over current R&D‑stage methods. The initiative aims to support next‑generation AI and high‑performance computing by delivering high‑capacity, low‑power data links through optical interconnects. NTT will act as an advisor, fostering industry collaboration and supply‑chain development.

💡 Why It Matters

· The project tackles the escalating power demands of AI data centers by advancing optical chiplet technology, potentially reshaping semiconductor manufacturing and enabling faster, greener AI workloads.

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