onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
AI-summarised brief · reviewed before publication
onsemi unveiled its Embedded Power Platform (EPP) on September 16, 2026, a new architecture that uses the silicon wafer itself as the package to integrate multiple power devices—such as silicon, SiC and GaN FETs, drivers and controllers—into a single wafer‑level module. By co‑optimizing electrical, mechanical and thermal performance from the design stage, EPP delivers three to five times the power density of existing solutions and simplifies system architecture for automotive, industrial and AI data‑center applications. The platform leverages onsemi’s existing 12‑inch wafer manufacturing, enabling seamless scaling and faster time‑to‑market while reducing development complexity. Executives highlighted that the approach blurs the line between semiconductor and packaging, positioning EPP as a foundational technology for the growing power demands of AI, electrification and autonomous systems.
💡 Why It Matters
- · By turning the wafer into an active system component, onsemi can meet AI‑driven power loads without the bulky, multi‑chip assemblies that have limited performance and slowed product cycles.
