Plasma for Stable Surface Processes in Chip Manufacturing

smttoday.com Oct 9, 2026

Plasma for Stable Surface Processes in Chip Manufacturing

Curated by Shubham · TechCapsules · Oct 9, 2026

AI-summarised brief · reviewed before publication

At SEMICON Europe in Munich (Nov. 10‑13, 2026), German firm Plasmatreat showcased its plasma‑based surface‑treatment portfolio for semiconductor fabrication at Booth 567, Hall C1. The company demonstrated four systems: the low‑pressure AURORA‑Plasma line, the dielectric‑barrier‑discharge GlowPlasma for uniform wafer treatment, Openair‑Plasma jets designed for particle‑free, potential‑free processing, and a dry‑oxide‑reduction process for metallic contacts. Plasmatreat explained that precise control of surface chemistry—removing organic residues, reducing oxides, and enhancing wetting and adhesion—is essential for downstream steps such as die attach, wire and hybrid bonding, under‑fill, molding and encapsulation, which directly affect yield and reliability. The vendor emphasized matching each plasma technology to substrate material, purity demands, and cleanroom automation requirements to ensure stable process windows across the semiconductor manufacturing flow.

💡 Why It Matters

· Reliable surface conditioning eliminates a major source of variability in advanced chip assembly, enabling higher yields without redesigning downstream equipment.

Capsules Semiconductors

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