Samsung might use a cost-cutting measure for Galaxy S27’s Exynos chip
sammobile.com May 15, 2026

Samsung might use a cost-cutting measure for Galaxy S27’s Exynos chip

AI-summarised brief · reviewed before publication

Samsung may remove Fan-Out Wafer-Level Packaging technology from the Exynos 2700 chip, expected to power the Galaxy S27 series, to cut costs. The technology, introduced with the Exynos 2400, improves heat management and performance but increases production costs. Samsung may adopt a Side-by-Side design for improved heat dissipation. The Exynos 2700 will reportedly feature a 10-core CPU and AMD RDNA 5-based GPU, with fabrication using Samsung's 2nm process technology, aiming to improve efficiency.

💡 Why It Matters

  • · Dropping advanced packaging technology could undermine Samsung's efforts to close the gap with rival chips.
  • · Samsung's shift to a new heat management solution may determine the Exynos 2700's competitiveness.