semiconductor-digest.com
Nov 9, 2026
SCHMID to Supply Equipment for Advanced Packaging Facility in South Asia
AI-summarised brief · reviewed before publication
SCHMID Group N.V. secured an order to supply critical wet‑process equipment for a U.S. company’s new glass‑core substrate manufacturing plant in South Asia, the region’s first advanced packaging facility centered on glass substrates and 3D heterogeneous integration. The plant aims to produce roughly 70,000 glass panels annually, supporting AI, data‑center, 5G, and aerospace applications. The project marks a shift from pilot to industrial‑scale production of glass core substrates, a technology poised to enable next‑generation AI processors and high‑performance computing.
💡 Why It Matters
- · The move signals a decisive step toward mass‑producing glass‑based substrates, a key enabler for future AI and high‑performance chips, and underscores South Asia’s emerging role in the global semiconductor supply chain.
