Teledyne Vision Solutions Demonstrates Single-Pass 300mm Wafer Inspection
AI-summarised brief · reviewed before publication
Teledyne Vision Solutions is showcasing its latest semiconductor inspection tools at SEMICON Europa 2026 in Munich. At Hall C2, Stand 136, the company will demonstrate the Linea ML 32K line‑scan camera, which can image a 300 mm wafer in a single pass at 10 µm resolution. The camera, the first true 32K line‑scan device, offers 32 K pixels, 2.5 µm pixel size and speeds up to 150 kHz, plus advanced modes such as multiline, HDR and TDI to boost defect detection and simplify system integration. Teledyne will also present the Z3 3D Measurement System, delivering up to 1.25 µm spatial resolution, 35 nm height repeatability and two‑second per‑wafer throughput. The Z3 combines high‑resolution 3D and 2D imaging for metrology of micro‑BGA, bumps, pillars, TGV/TSV, wafer bonding, flatness and defect analysis, supporting AI‑hardware production lines.
💡 Why It Matters
- · The ability to inspect a full 300 mm wafer in one pass at micron‑scale detail could dramatically cut cycle time and improve yield for next‑generation chip manufacturers.
