VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels

semiconductor-digest.com Oct 15, 2026

VON ARDENNE Scales HiPIMS Sputtering from Wafers to Panels

Curated by Shubham · TechCapsules · Oct 15, 2026

AI-summarised brief · reviewed before publication

VON ARDENNE, a Dresden‑based PVD specialist, announced at SEMICON West that its HISS horizontal inline platform will use high‑power impulse magnetron sputtering (HiPIMS) to deposit barrier and seed layers in through‑glass vias (TGVs) on panel‑level semiconductor substrates. The company’s tools accommodate panels up to 650 × 650 mm and operate inline, reducing vacuum breaks and handling risk. By pulsing plasma, HiPIMS improves ion bombardment for conformal coating, offering a cost‑effective alternative to ALD for high‑aspect‑ratio vias. The firm collaborates with glass suppliers and via‑drilling partners to optimize sidewall formation and adhesion layers.

💡 Why It Matters

· The move enables scalable, high‑throughput panel processing, a critical step as semiconductor devices shift toward larger, panel‑level form factors.
· It also positions VON ARDENNE to support future optical interposers, expanding the company’s role beyond traditional metal deposition.

Capsules Semiconductors

Read full article on semiconductor-digest.com

A Decade In, zeroRISC Sees A Bright Future For Open Silicon

ZeroRISC, founded by former Google OpenTitan lead Dominic Rizzo, is accelerating commercial adoption of open silicon root‑of‑trust (RoT) designs. In May, the startup partnered with Qualcomm, Analog Devices, Meta, and the Max Planck Institute to launch Pavona under GlobalPlatform, a neutral ecosystem for building secure hardware. Pavona offers a production‑ready post‑quantum cryptography stack and a composable platform for RoT and chip subsystems, mirroring open‑source software projects. The initiative builds on RISC‑V’s maturity and the semiconductor industry’s shift toward modular IP reuse, aiming to reduce costs, enhance transparency, and speed innovation.

💡 By providing a standardized, open framework for secure silicon, Pavona could lower entry barriers for startups and accelerate the deployment of resilient hardware across data centers and edge devices.

semiconductor-digest.com · Oct 15

Wooptix Brings Astronomy Optics to Wafer Metrology

Spanish firm Wooptix has introduced the Phemet system, applying wavefront phase imaging—originally used in astronomy—to semiconductor wafer metrology. The device captures an entire wafer in a single snapshot, generating about 16 million data points that reveal nanometer‑scale height maps, stress, and in‑plane distortion. By holding wafers vertically, the system eliminates gravity‑induced deformation, enabling predictive modeling of wafer behavior during lithography and deposition. Wooptix aims to deploy one tool per process step, potentially covering every wafer in advanced logic fabs.

💡 Phemet’s single‑shot, high‑resolution mapping could replace multiple offline metrology tools, reducing cycle time and improving process predictability in high‑volume fabs.

semiconductor-digest.com · Oct 15

NY Loves Nanotech Rebrands as Semiconductor Alliance NY

New York’s semiconductor marketing consortium rebranded as Semiconductor Alliance NY during its dessert reception at SEMICON West on Oct. 14. The new name, displayed alongside the state seal and the tagline “America’s fastest growing semiconductor ecosystem. Be a part of it,” aligns with Empire State Development’s current pitch for the state’s chip sector. The alliance, a coalition of economic developers, research institutions and private‑sector partners such as Empire State Development and National Grid, aims to accelerate New York’s high‑tech corridor by attracting investment, expanding supply chains, preparing sites for high‑volume manufacturing, supporting R&D, and building a skilled workforce. The rebrand replaces the legacy “NY Loves Nanotech” label, which originated in 1999 to court fab projects, reflecting the state’s shift from nanotech promotion to a full‑scale semiconductor ecosystem. Since 2022, New York has secured over $124 billion in semiconductor investment, $13 billion in state incentives, and $550 million for workforce development.

💡 The rename signals New York’s confidence that its comprehensive chip ecosystem can compete for the next wave of manufacturing and talent, positioning the state as a central hub in the national semiconductor supply chain.

thequantuminsider.com · Oct 15

SEALSQ to Showcase Post-Quantum Security Products at electronica 2026

SEALSQ Corp and its subsidiary IC’Alps will exhibit post‑quantum security solutions at electronica 2026 in Munich, from November 10‑13. The company will showcase the VaultIC409 secure element, QVault TPM, and QASIC custom ASIC design service, demonstrating TLS 1.3 and other industry applications. Live demos will cover automotive, medical, smart energy, smart home, and access‑control use cases, while a quantum‑computer mock‑up from partner Quobly will be displayed. Engineering samples of VaultIC409 are slated for Q2 2027.

💡 By unveiling hardware that embeds post‑quantum cryptography, SEALSQ positions itself at the forefront of the industry’s shift toward quantum‑resistant security, offering manufacturers a ready‑to‑integrate solution that could accelerate compliance with emerging standards.

semiconductor-digest.com · Oct 15

Show Daily 2026 — Day Three

SEMICON West released its Day Three show‑daily, a downloadable PDF that recaps the third day of the 2026 conference. The publication highlights industry news, session highlights and speaker bios, with a prominent feature on Kerry Hoffman. Hoffman brings more than three decades of advertising and media expertise across agency, client and publishing roles. She previously served as Director of Sales for Extension Media’s Semiconductor Manufacturing and Design Media Group, overseeing titles such as Solid State Technology and the ConFab conference. The profile notes her collaboration with Pete at Extension Media and underscores her deep connections within the semiconductor ecosystem. The daily also links to related articles, including SEMI’s announcement of a new global advanced‑packaging hub for future manufacturing collaborations initiatives.

💡 Highlighting Hoffman shows how veteran media leaders can accelerate knowledge flow between semiconductor innovators and markets at a critical growth juncture.

semiconductor-digest.com · Oct 15

GlobalFoundries to Operate Two New Fabs Under $21B U.S.–Japan Initiative

GlobalFoundries has been chosen to build and operate two new 300‑mm semiconductor fabs at its Malta, New York, site under a U.S.–Japan partnership that can provide up to $21 billion in funding. Japan will supply the capital while GlobalFoundries will supply technology and operational expertise. Each fab will add roughly 900,000 wafers of annual capacity, create about 27,000 construction and ecosystem jobs, and more than 1,000 high‑skill manufacturing positions. The first facility is slated to begin production in 2029, with construction expected to start later this year.

💡 The project injects critical U.S. manufacturing capacity into a sector vital for national security and economic resilience, while the public equity stake ensures American ownership in a key technology asset.