TechCapsules

Lumen Technologies and Microsoft announced an expanded co‑selling partnership aimed at simplifying enterprise AI adoption by integrating Lumen’s cloud‑native networking with Microsoft Azure. The collaboration addresses the fragmentation of networks that link data, applications, and infrastructure across public clouds, private data centers, and partner environments. Lumen will make its full suite of networking and connectivity services available through Azure and the Microsoft Marketplace, enabling customers to plan network transformation alongside Azure modernization and AI initiatives. Joint account [...]

Last year TechCrunch joined a larger media portfolio that now includes CIO, Computerworld, PCWorld and other outlets, expanding its editorial network. The integration gives TechCrunch access to shared Slack channels and a broader pool of writers and editors, fostering cross‑publication collaboration and content sharing. In a recent note to readers, the site highlighted this “extended family” by recommending articles from its new sister publications while watching a basketball game. The message also reminded audiences of a current [...]

pQCee Pte Ltd has signed a master aggregator agreement with Carahsoft Technology Corp., the leading U.S. government IT distributor, to sell its post‑quantum encryption software to federal, state, municipal, education and health‑care customers. Carahsoft will move pQCee’s suites through its reseller network and existing cooperative purchasing contracts, offering a drop‑in layer that implements NIST‑approved post‑quantum algorithms without replacing legacy systems. The partnership responds to Executive Order 14412, which obligates agencies to migrate high‑value assets away from vulnerable [...]

Netpoleon India has teamed with QNu Labs to broaden quantum‑safe cybersecurity offerings for Indian enterprises. The partnership merges QNu Labs’ QShield 2.0 platform—providing cryptographic risk profiling, operations, governance, and AI‑driven security—with Netpoleon India’s extensive channel partner and system integrator network. Together, they aim to help organizations in banking, government, defense, and telecommunications assess cryptographic exposure, enhance crypto‑agility, and prepare for quantum‑era threats. The collaboration underscores India’s push to strengthen indigenous quantum cybersecurity capabilities. [...]

Zumo and Quantum Chain signed a memorandum of understanding to develop quantum‑resilient infrastructure for the UK’s digital asset and blockchain finance sector. The partnership will test quantum‑safe solutions across private networks, tokenised deposits, payments, and institutional digital assets, including a potential quantum‑resistant GBP stablecoin. Both firms aim to provide cryptographic agility and post‑quantum security as the National Cyber Security Centre urges a full migration to post‑quantum cryptography by 2035, amid rising fears of cryptographically relevant quantum computers. [...]

Waymo announced that its Waymo for Business service now integrates with Ramp, a corporate expense management platform. The partnership automatically links Waymo ride receipts to Ramp accounts, eliminating manual upload and attachment steps for employees. Waymo has offered 24/7 autonomous ride-hailing to organizations for over a year, and the new integration streamlines expense reporting for businesses already using Ramp. The move aims to simplify travel management and reduce administrative overhead for corporate fleets.

Microsoft reported $10 billion in revenue from OpenAI in the quarter ended September 30, 2026, representing about 11% of its $92.3 billion quarterly total. The figure includes revenue‑sharing payments and other commercial arrangements. For the full fiscal year, OpenAI‑related revenue reached $24.1 billion, implying an annualized $40 billion at current pace. Microsoft also had $7.2 billion in receivables from OpenAI, up from $6 billion. The companies continue to share revenue through 2030 under a capped agreement.

Lam Research and imec have deepened their strategic partnership to accelerate the manufacturability of next‑generation three‑dimensional (3D) integration and high‑numerical‑aperture (NA) extreme ultraviolet (EUV) lithography. The expanded collaboration adds two joint R&D thrusts: developing processes for advanced 3D integration—including thick dielectric deposition, asymmetric stress compensation, bevel deposition, plasma dicing, and high‑aspect‑ratio memory structures—and advancing Lam’s Aether dry‑resist platform for high‑NA EUV patterning. Leveraging Lam’s deposition and etch expertise with imec’s integration and high‑NA EUV facilities, the teams [...]