TechCapsules

AI-summarised brief · reviewed before publication

HEIDENHAIN, a German precision‑motion company, showcased its METIS HP air‑bearing XY stage at SEMICON Taiwan, highlighting sub‑50 nm accuracy for advanced semiconductor packaging. The stage, featuring multi‑degree‑of‑freedom encoders and ironless, water‑cooled motors, delivers ±150 nm precision over a 600 mm × 600 mm travel and ±150 nm dynamic straightness at 1 m/s. CEO David Doyle emphasized the shift of front‑end motion control into back‑end packaging, noting the system’s rapid settling and vibration isolation as key to higher throughput.