Manz forecasts growth alongside industry
taipeitimes.com Aug 19, 2026

Manz forecasts growth alongside industry

AI-summarised brief · reviewed before publication

Manz Taiwan Ltd, a manufacturer of panel-level packaging equipment, reported a positive business outlook driven by rapid development in Taiwan’s semiconductor ecosystem. The company supplies electrochemical deposition machines for chip-on-panel-on-substrate and fan-out panel-level packaging, positioning itself as the third global supplier after Applied Materials and Lam Research. Manz has sold 50 units, with half designated for 700x700mm panels, though 310x310mm models are gaining traction. President Robert Lin stated that increasing AI chip sizes necessitate the cost efficiency of panel-level packaging over traditional circular wafers. CoPoS technology primarily serves AI chips, while FOPLP supports power management and radio frequency components. With half its customers based in Taiwan, Manz is expanding its local presence. The firm, which entered the semiconductor sector twelve years ago, plans to debut on the Taipei Exchange next June and list on the Taiwan Stock Exchange in 2028. Employees hold a 30 percent stake following a management buyout from German parent Manz AG.

💡 Why It Matters

  • · Manz’s rise as a third-tier global supplier breaks the duopoly of Applied Materials and Lam Research in critical AI packaging infrastructure.
  • · This diversification offers chipmakers vital alternatives to mitigate supply chain risks as demand for larger, more efficient AI chips accelerates.