New stacked chip gives wearables local memory, tops 90% accuracy in signal tests

interestingengineering.com Sep 29, 2026

New stacked chip gives wearables local memory, tops 90% accuracy in signal tests

Curated by Shubham · TechCapsules · Sep 29, 2026

AI-summarised brief · reviewed before publication

Researchers from KAIST, UNIST and POSTECH have created a vertically stacked semiconductor system that integrates carbon‑nanotube transistors with a solid‑state ionogel to provide on‑chip temporal memory. When voltage is applied, mobile ions in the ionogel shift and remain displaced after the voltage is removed, creating a short‑term electrical “memory.” By varying ion concentration and ionogel thickness, the team produced fast‑responding and slow‑responding layers, then stacked them so the upper layer captures recent signals while the lower layer retains earlier inputs. In tests, the stack distinguished all 16 possible patterns of four binary signals and, when used to classify video sequences of moving handwritten digits, achieved over 90 % validation accuracy. The technology could enable tiny wearables to analyze motion and physiological data locally without constant data off‑loading.

💡 Why It Matters

· Enabling edge devices to process temporal data on‑chip reduces reliance on external servers, paving the way for truly autonomous, power‑efficient wearables.

Read full article on interestingengineering.com

Korea launches its own version of popular US fund Roundhill Memory ETF…

South Korea’s Shinhan Asset Management has launched the Shinhan SOL Global DRAM Semiconductor Plus ETF, a domestically listed fund that mirrors the U.S. Roundhill Memory ETF (DRAM). The new product bundles global memory chipmakers—including Samsung Electronics, SK Hynix, Micron Technology, Kioxia and Western Digital—with semiconductor equipment firms such as ASML, Lam Research and Applied Materials. It trades in won on the Korea Exchange and is eligible for pension accounts, catering to strong retail demand for memory‑focused ETFs amid an AI‑driven surge in DRAM demand. The launch follows heightened interest in AI infrastructure, a tightening of rules on leveraged ETFs, and a shift toward retail and foreign investors as long‑term institutional participation wanes in Korea’s equity market.

💡 It gives Korean investors direct, won‑denominated exposure to the global memory boom without navigating foreign exchanges, potentially deepening domestic participation in AI‑related semiconductor growth.

businessworld.in · Sep 29

AMD To Acquire Fei-Fei Li’s World Labs For $8.2 Bn In AI…

Advanced Micro Devices announced an all‑stock acquisition of AI research firm World Labs for roughly $8.2 billion, a deal slated to close by the end of 2026 pending regulatory approval. World Labs co‑founder and chief scientist Fei‑Fei Li will become AMD’s executive vice president and chief scientist, reporting to CEO Lisa Su, while her team continues work on spatial‑intelligence models that generate and simulate 3‑D environments from text, images and video. The purchase gives AMD direct access to expertise in robotics, simulation and physical‑AI, complementing its existing GPU‑based model‑training collaborations with World Labs. AMD says the integration will inform its hardware, software and systems roadmaps as AI workloads expand beyond language models toward reasoning, robotics and immersive computing.

💡 By embedding world‑leading spatial‑AI research, AMD aims to accelerate its push into next‑generation AI hardware that can power 3‑D‑centric applications, a segment where competitors have limited native expertise.

semiconductor-digest.com · Sep 29

U.S. Government Selects Navitas to Develop Next-Generation 10 kV SiC Power Semiconductors

Navitas Semiconductor has been awarded the U.S. Army’s ALATTIS program to create a domestic manufacturing process for ultra‑high‑voltage (≥10 kV) silicon‑carbide (SiC) insulated‑gate bipolar transistors (IGBTs) and associated PiN diodes. After a competitive review, the Army selected Navitas for its proven UHV SiC track record, defense‑grade reliability, and a resilient U.S.–based supply chain. The ALATTIS prototype project, funded by the Army Research Laboratory and supported by the Joint Experimentation and Technology Accelerator, will iterate design, fabrication, and testing to validate the novel 10 kV SiC IGBT technology. Navitas’ GeneSiC portfolio already spans 650 V to 6.5 kV devices, and the award expands its leadership from MOSFETs to next‑generation IGBTs for critical defense and infrastructure systems.

💡 Delivering a home‑grown 10 kV SiC IGBT removes a strategic technology gap, giving the U.S. military and critical grids a secure, high‑power semiconductor source.

openpr.com · Sep 29

Asia-Pacific Upgradeable Computer Architecture Market Is Booming Worldwide | Intel Corporation ,…

The Asia‑Pacific upgradeable computer architecture market is experiencing rapid growth as enterprises and consumers seek modular systems that extend device lifecycles and adapt to evolving performance needs. A new market study outlines how processors, memory, storage, graphics and connectivity components can be swapped or expanded without replacing entire machines, catering to sectors ranging from consumer PCs to data‑center servers, gaming rigs, industrial equipment and AI edge devices. Leading chipmakers and OEMs—including Intel, AMD, NVIDIA, ASUS, Lenovo, Dell, HPE, Acer, ASRock, GIGABYTE, MSI, Samsung, SK Hynix, Kingston and Framework—are driving competition and innovation in modular designs. The report highlights AI‑intensive workloads, sustainability goals and the demand for scalable, repairable hardware as key catalysts for the market’s expansion across the region.

💡 Modular architectures let businesses upgrade performance on‑the‑fly, turning capital‑intensive hardware refresh cycles into incremental, cost‑effective enhancements. This shift directly reduces electronic waste while keeping Asia‑Pacific firms agile in the face of accelerating AI and cloud workloads.

ece.uw.edu · Sep 29

Training the next generation of microchip designers

The University of Washington’s Electrical and Computer Engineering department has launched two new undergraduate capstone courses—Integrated Systems Capstone and VLSI Capstone—where student teams design, fabricate, and test microchips for real‑world applications. Over roughly a year, students progress from circuit schematics to sending layouts to an industrial foundry, then evaluating the silicon. Professors Chris Rudell and Ang Li emphasize that the program creates a direct pathway to integrated‑circuit design careers for bachelor’s graduates, a route previously limited to graduate studies. The initiative aligns with federal efforts to strengthen U.S. semiconductor supply chains and national security, complementing broader workforce‑development programs such as UPWARDS for the Future and virtual‑reality training modules.

💡 By equipping undergraduates with end‑to‑end chip design experience, the program expands the talent pool needed to sustain America’s semiconductor resurgence.

semiconductor-digest.com · Sep 28

VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore

VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor and NXP Semiconductors, opened its first 12‑inch fab in Tampines, Singapore. The ceremony, attended by Singapore’s Trade Minister, EDB Chairman, and JTC CEO, marked the completion of 22 months of construction. The fab, now in risk production, will begin volume output in Q1 2027, targeting 44,000 wafers monthly by 2029. It supports 130‑nm to 40‑nm processes for mixed‑signal, power, analog, and interposer applications across HPC, mobile, automotive, industrial, and consumer markets. The facility incorporates AI‑driven automation, LEED and Green Mark standards, and plans to create 1,600 jobs while fostering industry‑academia collaboration.

💡 The new plant positions Singapore as a competitive hub for advanced semiconductor manufacturing, expanding local supply chains for high‑tech sectors. It also demonstrates a scalable, green production model that could set a benchmark for future fabs in the region.