semiconductor-digest.com
Oct 15, 2026
ZEISS SMT Expands from Lithography Optics into Advanced Packaging Process Control
AI-summarised brief · reviewed before publication
ZEISS Semiconductor Manufacturing Technology (SMT) has broadened its portfolio beyond lithography optics to include advanced packaging process control. The company now offers wafer‑by‑wafer bow correction with its DUNE system, inline X‑ray inspection via NLX, and a 300 mm FIB‑SEM platform, Intuitive 3D. These tools address critical issues in hybrid bonding, through‑silicon vias, and 3D NAND analysis. ZEISS also expands its mask‑related suite, aiming to extend mask lifetimes and support larger EUV formats. The expansion positions ZEISS as a comprehensive solutions provider for modern fabs.
💡 Why It Matters
- · By integrating end‑to‑end inspection and correction tools, ZEISS enables fabs to reduce defect rates and improve yield in increasingly complex packaging processes.
- · This holistic approach could streamline production and lower costs for leading foundries and IDMs.
