semiconductor-digest.com
AI’s Next Power Challenge Is Inside the Delivery Path
The semiconductor industry faces a critical challenge in power delivery to AI systems, with traditional lateral power architectures resulting in 15-20% power loss due to resistive losses. As device power levels climb and operating voltages drop, the industry is shifting towards vertical power delivery schemes to reduce losses and improve efficiency. Technologies like Saras Micro Devices' STILE platform embed passive functionality into system PCB and package structures, supporting voltage regulation demands and freeing board-level real estate. This [...]